Transient Liquid Phase Process in Ni–B Joining
نویسندگان
چکیده
منابع مشابه
Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
In this study, joining of Ni3Al intermetallic compounds using the transient liquid phase (TLP) process with Cu interlayer was investigated. The binding process was carried out in a vacuum furnace at a temperature of 1050 °C for different times of 30, 60, 90 and 120 minutes. The effect of time variation on microstructure and mechanical properties of the joint zone was investigated. The EDS analy...
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ژورنال
عنوان ژورنال: Materials Transactions, JIM
سال: 1997
ISSN: 0916-1821,2432-471X
DOI: 10.2320/matertrans1989.38.886